AN-7009 Dual Layout for BGA and SO8 Packages
نویسنده
چکیده
A few years ago, Fairchild Semiconductor introduced the BGA as the power package of the future. The BGA package offers superior parasitic resistance and inductance compared to all of the traditional power packages like DPAK, D2PAK, etc. The SO8 package has been the package of choice for the notebook computing market for a very long time. Most design engineers feel comfortable designing SO8 MOSFETs in their notebook applications because it has a good track record and most importantly there is a very large number of sources for devices packaged in SO8 packaging.
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تاریخ انتشار 2005